Blind & Buried PCB

The demand for faster processing times and reduction in size continues to drive the need for increased layer-count in printed circuit boards. One of the results of these design and technology requirements is the need for blind and buried vias. Incorporating blind or buried vias into a multilayer circuit board demands a higher level of innovation in PCB development. To manufacture these types of vias in a multilayer PCB requires either a process of sequential lamination of prepared components, or precise drilling of a completed multilayer PCB. Both methods demand additional time and attention in engineering and manufacturing to produce as compared with lower technology PCBs. Utilizing vias in your multilayer PCBs can significantly increase the number of connections without increasing the size. This brings speed and power to your project without compromise.

Capability

Standard

Board types

Multilayer up to 10 Layers

Board Profiling

CNC Rout

Score

Pierce Blank & Return

Minimum PWB trace width

5 mil ( 0.127 mm )

Minimum Track Width to feature spacing

5 mil ( 0.127 mm )

Smallest drilled hole

0.4 mm

Material Thickness

0.4 mm - 3.2 mm

Copper Thickness

Up to 6 oz Cu

Max board size

600 mm x 450mm

Standard Surface finish

Hot Air Solder Level

Alternative finishes

Electroless Nickel / Immersion Gold

Rohs

Electroless Tin Lead

Carbon

Hard Gold ( edge contact )

Peelable

Bare Board Test

Bed of Nails

Double-sided flying probe test

Solder mask

Photoimageable Resist with green, red,black,white & yellow colors .

Gold plate

Edge connectors Touch Pads